• DocumentCode
    831236
  • Title

    Avalanche Injection of Holes into SiO2

  • Author

    Aitken, J.M. ; Young, D.R.

  • Author_Institution
    IBM T. J. Watson Research Center P. O. Box 218 Yorktown Heights, N. Y. 10598
  • Volume
    24
  • Issue
    6
  • fYear
    1977
  • Firstpage
    2128
  • Lastpage
    2134
  • Abstract
    Avalanche injection techniques are used to provide hole currents through MOS capacitors and study the trapping of holes in the oxide layer. Although radiation is not in any way involved in these experiments, the trapped positive charge and surface states resulting from hole injection are similar to those obtained using radiation. The processing and oxide thickness dependence of hole trapping phenomena are also investigated. Prolonged post-oxidation annealing treatments are shown to lead to enhanced hole trapping in "hardened" oxides. Hole trapping cross-sections between 10-13 and 10-14 cm2 and trap densities between 1012 - 1013 cm-2 are measured depending on the processing conditions. The effective charge density is studied over the range of oxide thickness between 200 Ã… and 600 Ã… as a function of post-oxidation anneal in these "hardened" oxides. While the effective charge density is only weakly dependent on oxide thickness in unannealed oxides, in annealed oxides it exhibits a strong linear dependence of trapping on oxide thickness. The dependence on post-oxidation anneal time and ambient are also discussed. These results indicate a strong similarity between hole trapping induced by avalanche injection and by radiation.
  • Keywords
    Annealing; Electron traps; Hot carriers; Ionizing radiation; Lead compounds; MOS capacitors; Plasmas; Silicon; Substrate hot electron injection; Surface treatment;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.1977.4329178
  • Filename
    4329178