• DocumentCode
    831977
  • Title

    A New Admittance-Type Haptic Interface for Bimanual Manipulations

  • Author

    Peer, Angelika ; Buss, Martin

  • Author_Institution
    Inst. of Autom. Control Eng., Tech. Univ. Munchen, Munich
  • Volume
    13
  • Issue
    4
  • fYear
    2008
  • Firstpage
    416
  • Lastpage
    428
  • Abstract
    The concept of a new mobile haptic interface for bimanual manipulations in 6 DOFs is presented. The design of this mobile haptic interface is based on a modular system consisting of two components: two admittance-type haptic interfaces and a mobile platform. While the haptic interfaces cover only parts of the human arm workspace, the mobile platform extends these to arbitrarily wide remote environments. This paper mainly addresses the design and control concepts of the haptic interfaces, which are planned to be mounted on the mobile platform. The interfaces dispose of a large workspace and a high force/torque capability. A special design and control concept of the haptic interfaces makes it possible to decouple translational from rotational movements. This decoupling helps to significantly simplify the control algorithms that handle the interaction between the single components. Evaluation results concerning the Cartesian position tracking performance and the impedance display fidelity are provided. In addition, the following performance measures are analyzed: dextrous workspace, output capability, and backdrivability. In order to reduce the measurement effort, some of these measures are determined by model-based, others by measurement-based performance evaluation.
  • Keywords
    dexterous manipulators; haptic interfaces; telecontrol; Cartesian position tracking; admittance-type haptic interfaces; bimanual manipulations; dextrous workspace; human arm workspace; mobile haptic interface; modular system; remote environments; Inverse kinematics; mobile haptic interface; performance evaluation;
  • fLanguage
    English
  • Journal_Title
    Mechatronics, IEEE/ASME Transactions on
  • Publisher
    ieee
  • ISSN
    1083-4435
  • Type

    jour

  • DOI
    10.1109/TMECH.2008.2001690
  • Filename
    4598860