Capacitance characterization method for thick-conductor multiple planar ring structures on multiple substrate layers

Author

Tefiku, Faton ; Yamashita, Eikichi

Author_Institution

Dept. of Electr. Eng., Univ. of Electro-Commun., Tokyo, Japan

Volume

40

Issue

10

fYear

1992

fDate

10/1/1992 12:00:00 AM

Firstpage

1894

Lastpage

1902

Abstract

A capacitance characterization method for thick-conductor multiple planar ring structures on multiple substrate layers has been made by extending the rectangular boundary division method. The region to be considered in the analysis is divided into subregions of thick-wall cylindrical tubes in each of which Laplace´s equation is solved by the method of the separation of variables. A special application scheme of the boundary conditions is devised to decrease the number of necessary equations. Numerical results are shown for circular disk and planar ring structures in comparison with other available data

Keywords

boundary-value problems; capacitance; microwave integrated circuits; Laplace´s equation; boundary conditions; capacitance characterization method; circular disk; multiple substrate layers; rectangular boundary division method; separation of variables; thick-conductor multiple planar ring structures; Boundary conditions; Capacitance; Conductors; Coupling circuits; Dielectric substrates; Helium; Laplace equations; Microstrip; Microwave integrated circuits; Moment methods;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.159626

Filename

159626