• DocumentCode
    83583
  • Title

    Study of High- k /Metal-Gate Work Function Variation in FinFET: The Modified RGG Concept

  • Author

    Hyohyun Nam ; Changhwan Shin

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Univ. of Seoul, Seoul, South Korea
  • Volume
    34
  • Issue
    12
  • fYear
    2013
  • fDate
    Dec. 2013
  • Firstpage
    1560
  • Lastpage
    1562
  • Abstract
    Because the existing ratio of average grain size to gate area (RGG) method is not applicable for calculating the work function variation (WFV) in nonplanar device structures, a modified RGG method is used to quantitatively estimate the WFV in a high-k/metal-gate (HK/MG) FinFET. A plot of the calculated WFV against the RGG for the FinFET with a TiN gate-stack is validated by previous simulation results. The standard deviation of the WFV, σ(WFV), of the nonplanar multigate device structure (e.g., the FinFET) is lower than that of a planar device structure by ~30%.
  • Keywords
    MOSFET; high-k dielectric thin films; work function; RGG concept; TiN gate-stack; WFV; gate area; grain size; high-k-metal-gate FinFET; high-k-metal-gate work function; nonplanar device structures; nonplanar multigate device structure; standard deviation; work function variation; FinFETs; Grain size; High K dielectric materials; Logic gates; Titanium compounds; CMOS; Characterization; FinFET; MOSFET; ratio of average grain size to gate area (RGG); variability; work function variation (WFV);
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2013.2287283
  • Filename
    6656908