DocumentCode
83583
Title
Study of High-
/Metal-Gate Work Function Variation in FinFET: The Modified RGG Concept
Author
Hyohyun Nam ; Changhwan Shin
Author_Institution
Sch. of Electr. & Comput. Eng., Univ. of Seoul, Seoul, South Korea
Volume
34
Issue
12
fYear
2013
fDate
Dec. 2013
Firstpage
1560
Lastpage
1562
Abstract
Because the existing ratio of average grain size to gate area (RGG) method is not applicable for calculating the work function variation (WFV) in nonplanar device structures, a modified RGG method is used to quantitatively estimate the WFV in a high-k/metal-gate (HK/MG) FinFET. A plot of the calculated WFV against the RGG for the FinFET with a TiN gate-stack is validated by previous simulation results. The standard deviation of the WFV, σ(WFV), of the nonplanar multigate device structure (e.g., the FinFET) is lower than that of a planar device structure by ~30%.
Keywords
MOSFET; high-k dielectric thin films; work function; RGG concept; TiN gate-stack; WFV; gate area; grain size; high-k-metal-gate FinFET; high-k-metal-gate work function; nonplanar device structures; nonplanar multigate device structure; standard deviation; work function variation; FinFETs; Grain size; High K dielectric materials; Logic gates; Titanium compounds; CMOS; Characterization; FinFET; MOSFET; ratio of average grain size to gate area (RGG); variability; work function variation (WFV);
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2013.2287283
Filename
6656908
Link To Document