• DocumentCode
    837993
  • Title

    Heat Transfer Performance of Metal Foam Heat Sinks Subjected to Oscillating Flow

  • Author

    Jin, Liwen ; Leong, Kai Choong

  • Author_Institution
    Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore
  • Volume
    29
  • Issue
    4
  • fYear
    2006
  • Firstpage
    856
  • Lastpage
    863
  • Abstract
    This paper reports the results of an experimental investigation on the heat transfer performance of metal foam as a heat sink subjected to oscillating flow. The measured pressure drops, velocities, and surface temperatures of oscillating flow through aluminum 40 PPI foam are presented in detail. The calculated cycle-averaged local temperatures and Nusselt numbers for different kinetic Reynolds numbers were analyzed. The variation of total heat transfer rate with a kinetic Reynolds number suggests that oscillating flow at relative low frequency has a substantial effect on heat transfer enhancement in a metal foam heat sink. A comparison of the length-averaged Nusselt numbers between oscillating and steady flows indicates that higher heat transfer rates can be obtained in metal foams subjected to oscillating flow. The relation between pumping power and total heat transfer rates for the oscillating flow cooling system was also analyzed with a view to designing a novel heat sink using metal foam. The results show that high heat transfer performance of metal foam heat sinks subject to oscillating flow can be obtained with moderate pumping power
  • Keywords
    aluminium; fluid oscillations; heat sinks; heat transfer; metal foams; Nusselt numbers; aluminum 40 PPI foam; aluminum foam; cooling system; heat transfer; kinetic Reynolds numbers; metal foam heat sinks; oscillating flow; pumping power; Aluminum; Fluid flow measurement; Heat pumps; Heat sinks; Heat transfer; Kinetic theory; Metal foam; Pressure measurement; Temperature; Velocity measurement; Aluminum foam; Nusselt number; kinetic Reynolds number; oscillating flow; pressure drop;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2006.885968
  • Filename
    4016225