DocumentCode :
83817
Title :
Analysis and Modeling of High-Power Phosphor-Coated White Light-Emitting Diodes With a Large Surface Area
Author :
Huan Ting Chen ; Siew-Chong Tan ; Hui, Shu Yuen Ron
Author_Institution :
Dept. of Electr. & Electron. Eng., Univ. of Hong Kong, Hong Kong, China
Volume :
30
Issue :
6
fYear :
2015
fDate :
Jun-15
Firstpage :
3334
Lastpage :
3344
Abstract :
Modern high-power white light-emitting diodes (LEDs) composed of multiple blue LED chips and yellow phosphor coatings have been successfully commercialized because of their high-luminous efficacy. The multiple-chip LED packages usually come with flat structures that have large surface areas for considerable heat loss. Starting from the analysis and modeling of the blue LED chip, this paper introduces the thermal path through the phosphor layer to form the white phosphor-coated (PC) white LED device model for photometric, electric, and thermal performance analysis. The power distribution of the blue LED chip and that of the PC white LED device are compared. Based on this new analysis, the increase in the heat dissipation coefficient, equivalent thermal resistance, and power loss caused by the phosphor coating can be quantified. New equations suitable for device manufacturers to qualify their devices and design engineers to optimize LED system designs are derived. The analytical results are in good agreement with the practical mesurements.
Keywords :
cooling; light emitting diodes; phosphors; thermal management (packaging); blue LED chip; electric performance analysis; equivalent thermal resistance; heat dissipation coefficient; high-power phosphor-coating; large surface area; phosphor layer; photometric performance analysis; power distribution; power loss; thermal path; thermal performance analysis; white LED; white light-emitting diodes; white phosphor-coated LED; Coatings; Heating; Light emitting diodes; Mathematical model; Phosphors; Thermal resistance; Light-emitting diodes; phosphor-coated white LEDs; photo-electro-thermal theory; thermal model;
fLanguage :
English
Journal_Title :
Power Electronics, IEEE Transactions on
Publisher :
ieee
ISSN :
0885-8993
Type :
jour
DOI :
10.1109/TPEL.2014.2336794
Filename :
6849999
Link To Document :
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