• DocumentCode
    839677
  • Title

    Complementary vertical bipolar transistor process using high-energy ion implantation

  • Author

    Ragay, F.W. ; Aarnink, A.A.I. ; Wallinga, H.

  • Author_Institution
    MESA Res. Inst., Twente Univ., Enschede, Netherlands
  • Volume
    27
  • Issue
    23
  • fYear
    1991
  • Firstpage
    2141
  • Lastpage
    2143
  • Abstract
    High-energy ion implantation is used as a key processing step in the formation of a complementary bipolar process with both transistor types being vertical. Both n-p-n and p-n-p transistors are made vertically with a deep implanted collector region. Combinations of epitaxial and buried layers are avoided. Both transistors have an ideal Gummel plot with a current gain of about 60. Cutoff frequencies of over 1 GHz have been measured, which is much higher than for conventional lateral p-n-p transistors.
  • Keywords
    bipolar integrated circuits; integrated circuit technology; ion implantation; 1 GHz; complementary bipolar process; deep implanted collector region; high-energy ion implantation; ideal Gummel plot; vertical bipolar transistor;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19911326
  • Filename
    104088