Title :
Fabrication of a/c axes oriented grain boundaries in YBCO films by selective growth
Author :
Shingai, Y. ; Mukaida, M. ; Ichinose, A. ; Horii, S. ; Yoshida, Y. ; Matsumoto, K. ; Hirose, F. ; Koike, K. ; Saito, A. ; Ohshima, S.
Author_Institution :
Dept. of Electron. Eng., Yamagata Univ., Japan
fDate :
6/1/2005 12:00:00 AM
Abstract :
The a/c axes grain boundaries of YBCO films are very interesting from the viewpoints of Josephson junction technology and the magnetic flux pinning. In this paper, we intend to flow superconducting current along the grain boundary and to prevent the magnetic flux motion from passing across the grain boundary. The a/c axes grain boundaries were fabricated on SrLaGaO4 (100) substrates by pulsed laser deposition on Gd2CuO4 (GCO) buffer layers. The preferred orientation and in-plane orientation of the films were characterized by X-ray θ/2θ diffraction and φ-scan spectroscopy. 4-micrometer pitch GCO patterns were fabricated by a lithography technology. Subsequently, the YBCO films were deposited on the pattern. A TEM image showed that a-axis grains grew over c-axis grains.
Keywords :
barium compounds; critical currents; epitaxial growth; gadolinium compounds; grain boundaries; lanthanum compounds; magnetic flux; pulsed laser deposition; strontium compounds; superconducting junction devices; superconducting thin films; yttrium compounds; Φ-scan spectroscopy; Gd2CuO4; Josephson junction technology; SrLaGa3O7; X-ray; YBa2Cu3O7; a-axis grains; a-axis oriented YBCO film; a/c axes oriented grain boundary; buffer layers; c-axis grains; in-plane orientation; lithography technology; magnetic flux motion; magnetic flux pinning; pulsed laser deposition; selective growth; superconducting current; Fabrication; Grain boundaries; Josephson junctions; Magnetic films; Magnetic flux; Optical pulses; Pulsed laser deposition; Superconducting films; X-ray lasers; Yttrium barium copper oxide; YBCO; a-axis oriented YBCO film; grain boundaries; selective growth; thin film;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2005.848653