Title :
Comments on "Handling soft modules in general nonslicing floorplan using Lagrangian relaxation"
Author :
Moh, Teng-Sheng ; Chang, Tsu-Shuan
Author_Institution :
Quicktran Corp., Cupertino, CA, USA
Abstract :
The most important contribution in the title paper by F.Y. Young et al. [ibid., vol. 20, pp. 687-692, 2001] is that they devised an efficient method to compute the shapes of soft modules to give the optimal packing, as described by the authors. We would like to clarify a misunderstanding that occurred when the authors referred to our paper [IEEE Trans. Circuits Syst. I, vol. 43, pp. 713-720, 1996].
Keywords :
circuit layout CAD; circuit optimisation; geometric programming; integrated circuit layout; matrix multiplication; Lagrangian Multipliers; Lagrangian relaxation; general nonslicing floorplan; geometric figure; geometric programming; handling soft modules; multiple local minima; optimal packing; Lagrangian functions; Shape; Topology; Very large scale integration;
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
DOI :
10.1109/TCAD.2003.819428
