Encapsulant for nonhermetic multichip packaging applications

Author

Lin, Albert W. ; Wong, Ching-Ping

Author_Institution

AT&T Bell Labs., Murray Hill, NJ, USA

Volume

15

Issue

4

fYear

1992

fDate

8/1/1992 12:00:00 AM

Firstpage

510

Lastpage

518

Abstract

An encapsulant study that identifies a robust silicone material suitable for multichip packaging (MCP) applications is presented. The properties/characteristics of encapsulant needed for the MCP applications are identified. A literature survey then leads to the selection of six types of encapsulants for a screening test. The encapsulants were tested at 85°C/85% relative humidity with DC bias and in situ leakage current monitoring. A modified silicone encapsulant (MSE) was identified as the most promising material and was subjected to more in-depth studies. Test samples encapsulated with MSE were exposed to five selected chemicals to study their chemical resistance. The samples were then subjected to a temperature-humidity-bias (THB) test for moisture protection studies. In addition, studies such as material formulation, adhesion, mechanical protection, and temperature cycling were conducted

Keywords

encapsulation; environmental testing; materials testing; multichip modules; packaging; silicones; DC bias; MCM; THB; adhesion; chemical resistance; encapsulant; literature survey; material formulation; mechanical protection; moisture protection studies; nonhermetic multichip packaging; relative humidity; screening test; silicone encapsulant; silicone material; situ leakage current monitoring; temperature cycling; temperature-humidity-bias tests; tests; types of encapsulants; Chemicals; Conducting materials; Humidity; Leakage current; Moisture; Monitoring; Packaging; Protection; Robustness; Testing;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.159881

Filename

159881