Title :
Evaluation of manufacturing variables in the reliability of surface mount capacitors
Author :
Condra, Lloyd W. ; Johnson, Grant M. ; Pecht, Michael G. ; Christou, Aris
Author_Institution :
ELDEC Corp., Bothell, WA, USA
fDate :
8/1/1992 12:00:00 AM
Abstract :
The reliability of surface mount capacitors assembled under a variety of conditions has been evaluated in temperature cycling, vibration, altitude, and temperature-humidity-bias (THB) environments. Both initial assembly (vapor phase) and rework processes were used to assemble capacitors to alumina substrates, with the following variables: assembly thermal conditions, capacitor manufacturer, conformal coating materials, and number of assembly cycles. Failure rates were higher for the rework process than for the initial assembly process. The failures observed in environmental testing correlated well with earlier scanning laser acoustic microscopy (SLAM) testing on capacitors prior to assembly, and SLAM testing has been implemented as a screen for incoming capacitors
Keywords :
acoustic microscopy; capacitors; environmental testing; inspection; integrated circuit manufacture; reliability; surface mount technology; thick film circuits; Al2O3 substrates; SLAM; SMT; THB; altitude; assembly thermal conditions; capacitor manufacturer; conformal coating materials; environmental testing; failure rate; incoming inspection; initial assembly; manufacturing variables; number of assembly cycles; reliability; rework processes; scanning laser acoustic microscopy; screen for incoming capacitors; surface mount capacitors; temperature cycling; temperature-humidity-bias; vapor phase; vapor phase reflow soldering; vibration; Acoustic testing; Assembly; Capacitors; Ceramics; Manufacturing; Residual stresses; Simultaneous localization and mapping; Substrates; Temperature; Thermal stresses;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
