A new packaging technology using micro-solder bumps for high-speed photoreceivers

Author

Tsunetsugu, Hideki ; Katsura, Kohsuke ; Hayashi, Tsuyoshi ; Ishitsuka, Fuminori ; Hata, Susumu

Author_Institution

NTT Interdisciplinary Res. Labs., Tokyo, Japan

Volume

15

Issue

4

fYear

1992

fDate

8/1/1992 12:00:00 AM

Firstpage

578

Lastpage

582

Abstract

A packaging technology for high-speed photoreceivers with a photodiode and a preamplifier is introduced. This technology features the following key interconnection technologies: micro-solder bumps, an impedance matched film carrier, and an optical fiber unit. Micro-solder bumps eliminate parasitic elements of the interconnection between the preamplifier and the package, and provides an impedance matched interconnection. The optical fiber unit with hemispherical-lensed fibers carries out high-efficiency optical coupling. The photoreceiver fabricated by applying these technologies achieves 3 dB bandwidth at over 20 GHz. This packaging technology should be effective for future high-speed optical transmission systems of over 10 Gbit/s

Keywords

flip-chip devices; optical couplers; optical receivers; packaging; soldering; 10 Gbit/s; 20 GHz; bandwidth; flip chips; hemispherical-lensed fibers; high-speed optical transmission systems; high-speed photoreceivers; impedance matched film carrier; impedance matched interconnection; key interconnection technologies; micro-solder bumps; optical coupling; optical fiber unit; packaging technology; Bandwidth; High speed optical techniques; Impedance; Optical coupling; Optical fibers; Optical films; Optical interconnections; Packaging; Photodiodes; Preamplifiers;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.159888

Filename

159888