On-Chip Electrical Breakdown of Metallic Nanotubes for Mass Fabrication of Carbon-Nanotube-Based Electronic Devices

Author

Buh, Gyoung-Ho ; Hwang, Jea-Ho ; Jeon, Eun-Kyoung ; So, Hye-Mi ; Lee, Jeong-O ; Kong, Ki-Jeong ; Chang, Hyunju

Author_Institution

Korea Res. Inst. of Chem. Technol., Daejeon

Volume

7

Issue

5

fYear

2008

Firstpage

624

Lastpage

627

Abstract

A mass fabrication scheme for carbon-nanotube (CNT)-based electronic devices is developed by combining the semiconductor wafer electrical sorting with selective burning of metallic CNT wires. By applying a millisecond electrical pulse to CNTs with the optimized logical scheme of voltage stress, we successfully removed the metallic CNTs but not the high-performance semiconductor CNTs. The fabrication scheme implemented with a probe card achieved a 100 % gross yield of CNT-based sensors with a short process time.

Keywords

carbon nanotubes; electric sensing devices; field effect transistors; mass production; nanoelectronics; nanotube devices; nanowires; semiconductor device breakdown; system-on-chip; CNT-based sensors; CNTFET; carbon-nanotube-based electronic devices; mass fabrication scheme; metallic nanotubes wires; millisecond electrical pulse; nanomanufacturing; nanotechnology; on-chip electrical breakdown; optimized logical scheme; probe card; process time; selective burning; semiconductor wafer electrical sorting; voltage stress; Carbon nanotube; nano manufacturing; nanotechnology; sensor;

fLanguage

English

Journal_Title

Nanotechnology, IEEE Transactions on

Publisher

ieee

ISSN

1536-125X

Type

jour

DOI

10.1109/TNANO.2008.2004624

Filename

4604724