DocumentCode
843503
Title
Multichip packaging-a tutorial
Author
Tummala, Rao R.
Author_Institution
IBM Corp., Hopewell Junction, NY, USA
Volume
80
Issue
12
fYear
1992
fDate
12/1/1992 12:00:00 AM
Firstpage
1924
Lastpage
1941
Abstract
Several aspects of the multichip module technology, including its functions, leverages, applications, and markets, are reviewed. All the packaging technologies used in multichip, such as sealing and encapsulation, heat removal, chip level connections, thin film, ceramic, and printed wiring, are discussed. The module corrections and electrical testing used in forming a high-performance or portable system are also discussed
Keywords
encapsulation; hybrid integrated circuits; integrated circuit technology; multichip modules; reviews; seals (stoppers); MCM packaging; ceramic; chip level connections; electrical testing; encapsulation; heat removal; multichip module technology; printed wiring; sealing; thin film; Aerospace electronics; Aerospace industry; Automotive engineering; Consumer electronics; Electronics packaging; Encapsulation; Semiconductor device packaging; Space technology; Substrates; Tutorial;
fLanguage
English
Journal_Title
Proceedings of the IEEE
Publisher
ieee
ISSN
0018-9219
Type
jour
DOI
10.1109/5.192073
Filename
192073
Link To Document