DocumentCode :
843523
Title :
Design of multichip modules
Author :
Schaper, Leonard W.
Author_Institution :
Alcoa Electron. Packaging., San Diego, CA, USA
Volume :
80
Issue :
12
fYear :
1992
fDate :
12/1/1992 12:00:00 AM
Firstpage :
1955
Lastpage :
1964
Abstract :
The process and pitfalls of multichip module (MCM) design, including the constraints, tradeoffs, figures of merit, and considerations which make MCM design a unique interdisciplinary challenge are discussed. The MCM must provide the proper operating environment for the chips it contains. It must also fit the constraints of the system in which it is contained. It must be manufacturable, testable, and repairable. The many aspects of MCM design are described, starting with system benefits, then system and MCM partitioning, chip environment, system constraints, and infrastructure/manufacturing issues
Keywords :
hybrid integrated circuits; multichip modules; MCM design; MCM partitioning; chip environment; manufacturing; multichip modules; packaging; Art; Books; Conference proceedings; Delay effects; Design automation; Manufacturing; Multichip modules; Packaging; Process design; Testing;
fLanguage :
English
Journal_Title :
Proceedings of the IEEE
Publisher :
ieee
ISSN :
0018-9219
Type :
jour
DOI :
10.1109/5.192075
Filename :
192075
Link To Document :
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