DocumentCode
849376
Title
Forced Air Cooling of CPUs With Heat Sinks: A Numerical Study
Author
Ozturk, Emre ; Tari, Ilker
Author_Institution
Anova CAD-CAE-TEST, ODTU-OSTIM, Ankara
Volume
31
Issue
3
fYear
2008
Firstpage
650
Lastpage
660
Abstract
A common ATX form factor personal computer system is modeled in detail. The flow and temperature fields inside the chassis are numerically investigated as a conjugate heat transfer problem. The computational effort is concentrated on the forced air cooling of the CPU using a heat sink. Three different commercial heat sink designs are analyzed by using commercial computational fluid dynamics software packages Icepak and Fluent. The grid independent, well converged, and well posed simulations are performed, and the results are compared with the experimental data. It is observed that flow obstructions in the chassis and the resulting air recirculation affect the heat sink temperature distribution. The specific thermal resistance values for the heat sinks are compared. It is observed that although they have different geometries, all of the three heat sinks have similar specific thermal resistances. The best heat sink is selected and modified in order to have a lower maximum temperature distribution in the heat sink by changing the geometry and the material. Especially, replacing aluminum with copper as the heat sink material improved the performance. The importance of modeling the entire chassis is demonstrated by comparing the simulation results with the results from a model of only the CPU-heat-sink-fan assembly.
Keywords
computational fluid dynamics; cooling; heat sinks; microcomputers; software packages; temperature distribution; CPU; Fluent; Icepak; air recirculation; common ATX form factor; computational fluid dynamics; conjugate heat transfer; forced air cooling; heat sink fan assembly; personal computer system; software packages; specific thermal resistance; temperature distribution; Central processing unit (CPU) cooling; computational fluid dynamics; conjugate heat transfer; forced convection; heat sink improvement;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2008.2001840
Filename
4609939
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