DocumentCode :
850725
Title :
O/sup 2/ABA: a novel high-performance predictable circuit architecture for the deep submicron era
Author :
Im, Yonghee ; Roy, Kaushik
Author_Institution :
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
Volume :
10
Issue :
3
fYear :
2002
fDate :
6/1/2002 12:00:00 AM
Firstpage :
221
Lastpage :
229
Abstract :
Current VLSI design techniques focus on four major goals: higher integration, faster speed, lower power, and shorter time-to-market. These goals have been accomplished mainly by deep submicron (DSM) technology along with voltage scaling. However, scaling down of feature size causes larger interwire capacitance which results in large crosstalk between interconnects. In this paper, we propose a novel predictable circuit architecture, named "optimized overlaying array-based architecture" (O/sup 2/ABA), especially suited for the deep submicron regime. O/sup 2/ABA achieves reduction in crosstalk by considering the current directions and by reducing interwire capacitance. The introduction of "unit cell" leads to regularity, which makes the performance predictable even before layout, and shortens design time. O/sup 2/ABA is compared with other design styles, such as custom design and standard cell approach, in terms of coupling capacitance, area, and delay.
Keywords :
CMOS logic circuits; VLSI; adders; circuit layout CAD; crosstalk; integrated circuit layout; logic CAD; multiplying circuits; Miller coefficient factor; O/sup 2/ABA circuit architecture; VLSI design; crosstalk reduction; current directions; custom design; deep submicron; delay fault; dynamic circuit; dynamic logic; dynamic noise margin; four-bit full-adder circuit; high-performance predictable circuit architecture; interwire capacitance; moment matching technique; optimized overlaying array-based architecture; ripple-carry multiplier; scaled CMOS technologies; signal integrity; standard cell; unit cell; Capacitance; Circuit noise; Coupling circuits; Crosstalk; Delay; Integrated circuit interconnections; Logic; Time to market; Very large scale integration; Wiring;
fLanguage :
English
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
1063-8210
Type :
jour
DOI :
10.1109/TVLSI.2002.1043325
Filename :
1043325
Link To Document :
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