• DocumentCode
    850882
  • Title

    A Dielectrically - Isolated Radiation Hardened Technology for LSI

  • Author

    Sanders, T.J. ; Boarman, J.W. ; Wood, G.M. ; Kasten, A.J.

  • Author_Institution
    Harris Semiconductor Melbourne, Florida 32901 (305) 724-7547
  • Volume
    27
  • Issue
    6
  • fYear
    1980
  • Firstpage
    1716
  • Lastpage
    1720
  • Keywords
    Apertures; Dielectric thin films; Integrated circuit interconnections; Integrated circuit technology; Isolation technology; Large scale integration; Photoconductivity; Radiation hardening; Resistors; Testing;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.1980.4331094
  • Filename
    4331094
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=850882