DocumentCode
85128
Title
Low-Resistivity Long-Length Horizontal Carbon Nanotube Bundles for Interconnect Applications—Part II: Characterization
Author
Hong Li ; Wei Liu ; Cassell, Alan M. ; Kreupl, Franz ; Banerjee, Kunal
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of California, Santa Barbara, Santa Barbara, CA, USA
Volume
60
Issue
9
fYear
2013
fDate
Sept. 2013
Firstpage
2870
Lastpage
2876
Abstract
Due to the enormous challenges of fabricating long horizontally aligned carbon nanotube (HACNT) bundle interconnects, there exists little research on characterization of long HACNT interconnects. In this paper, taking advantage of our unique HACNT fabrication process outlined in the companion paper, the electrical and self-heating characterization of long HACNT bundles are reported. Negative temperature coefficients of resistance for both per unit length resistance and metal-CNT contact resistance are confirmed from measurements. This first report on the electrical and thermal characterization fills the wide gap between CNT interconnect modeling efforts and corresponding experimental efforts by providing many important extracted parameters that are critical in various modeling and analyses.
Keywords
carbon nanotubes; contact resistance; interconnections; HACNT fabrication process; electrical characterization; interconnect applications; low-resistivity long-length horizontal carbon nanotube bundles; metal-CNT contact resistance; negative temperature coefficients; per unit length resistance; self-heating characterization; thermal characterization; Atmospheric measurements; Conductivity; Current density; Electrical resistance measurement; Fabrication; Resistance; Temperature measurement; Carbon nanotubes; characterization; horizontally aligned; interconnects; resistivity; self-heating; temperature coefficient of resistance;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2013.2275258
Filename
6581868
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