DocumentCode
853569
Title
Foreword
Author
Sung Yi ; Whalley, David C. ; Conway, Paul P.
Author_Institution
Portland State University
Volume
26
Issue
3
fYear
2003
fDate
7/1/2003 12:00:00 AM
Firstpage
198
Lastpage
199
Keywords
Automotive engineering; Electronic packaging thermal management; Electronics packaging; Integrated circuit manufacture; Integrated circuit packaging; Integrated circuit reliability; Manufacturing processes; Mechanical engineering; Soldering; Thermal management of electronics;
fLanguage
English
Journal_Title
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
1521-334X
Type
jour
DOI
10.1109/TEPM.2003.822298
Filename
1256720
Link To Document