• DocumentCode
    85360
  • Title

    A Novel Isolation Method for Half-Bridge Power ICs

  • Author

    Moufu Kong ; Xingbi Chen

  • Author_Institution
    State Key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • Volume
    60
  • Issue
    7
  • fYear
    2013
  • fDate
    Jul-13
  • Firstpage
    2318
  • Lastpage
    2323
  • Abstract
    A novel integrated solution for two high voltage power n-channel MOSFET transistors (NMOSTs) MH and ML and two level-shifting high-voltage NMOSTs M1 and M2 are proposed to save chip area and reduce process complexity. The optimized variation lateral doping technique is used for designing the four NMOSTs. The four NMOSTs are isolated by PN junction isolation technique to integrate together. The isolation areas between ML and M1 and M1 and M2 are needed to sustain high voltage in X-direction. Hence, the effective surface charge density distribution in the isolation areas is designed almost the same as the NMOST. The layout area of the two level-shifting high-voltage NMOSTs of the proposed solution is only 6.61% of that conventional one. The simulation results from TCAD MEDICI and DAVINCI show that the expectant functions are well achieved.
  • Keywords
    MOSFET; p-n junctions; power integrated circuits; semiconductor doping; surface charging; technology CAD (electronics); DAVINCI; TCAD MEDICI; X-direction; effective surface charge density distribution; half-bridge power IC; high voltage power n-channel MOSFET transistors; level-shifting high-voltage NMOST design; optimized variation lateral doping technique; p-n junction isolation technique; process complexity reduction; Effective surface charge density; HVIC; OPTVLD; PN junction isolation;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2013.2263578
  • Filename
    6522819