DocumentCode
85360
Title
A Novel Isolation Method for Half-Bridge Power ICs
Author
Moufu Kong ; Xingbi Chen
Author_Institution
State Key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Volume
60
Issue
7
fYear
2013
fDate
Jul-13
Firstpage
2318
Lastpage
2323
Abstract
A novel integrated solution for two high voltage power n-channel MOSFET transistors (NMOSTs) MH and ML and two level-shifting high-voltage NMOSTs M1 and M2 are proposed to save chip area and reduce process complexity. The optimized variation lateral doping technique is used for designing the four NMOSTs. The four NMOSTs are isolated by PN junction isolation technique to integrate together. The isolation areas between ML and M1 and M1 and M2 are needed to sustain high voltage in X-direction. Hence, the effective surface charge density distribution in the isolation areas is designed almost the same as the NMOST. The layout area of the two level-shifting high-voltage NMOSTs of the proposed solution is only 6.61% of that conventional one. The simulation results from TCAD MEDICI and DAVINCI show that the expectant functions are well achieved.
Keywords
MOSFET; p-n junctions; power integrated circuits; semiconductor doping; surface charging; technology CAD (electronics); DAVINCI; TCAD MEDICI; X-direction; effective surface charge density distribution; half-bridge power IC; high voltage power n-channel MOSFET transistors; level-shifting high-voltage NMOST design; optimized variation lateral doping technique; p-n junction isolation technique; process complexity reduction; Effective surface charge density; HVIC; OPTVLD; PN junction isolation;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2013.2263578
Filename
6522819
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