• DocumentCode
    855330
  • Title

    The Effect of Ion Implantation on the Fatigue Behavior of Metals and Alloys

  • Author

    Chakrabortty, S.B. ; Kujore, A. ; Starke, E.A., Jr. ; Legg, K.O.

  • Author_Institution
    Fracture and Fatigue Research Laboratory
  • Volume
    28
  • Issue
    2
  • fYear
    1981
  • fDate
    4/1/1981 12:00:00 AM
  • Firstpage
    1812
  • Lastpage
    1815
  • Abstract
    The effect of ion implantation on the strain and stress controlled fatigue behavior of polycrystalline copper has been investigated. The cyclic stress-strain response, strain-life and stress-life relationships and fatigue crack nucleation behavior have been studied. The results from the non-implanted materials have been compared with those from the implanted materials. Four implant species, one with a positive misfit, one with a negative misfit, one with a zero misfit, and one insoluble under equilibrium conditions have been used. Most of the fatigue tests were performed in laboratory air. Ion implantation changes the surface deformation behavior for both monotonic and cyclic loading with a corresponding change in hardening rate. Larger changes are observed for the cyclic loading. Implantations which lead to a more homogeneous deformation (fine slip) near the surface, improves the resistance to fatigue crack initiation. Surface compressive residual stresses, induced from implanting a positive misfit species, have a major influence on crack initiation in the stress-life regime.
  • Keywords
    Capacitive sensors; Copper; Fatigue; Implants; Ion implantation; Strain control; Stress control; Surface cracks; Surface resistance; Testing;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.1981.4331527
  • Filename
    4331527