• DocumentCode
    85660
  • Title

    A Compact EBG Structure With Wideband Power/Ground Noise Suppression Using Meander-Perforated Plane

  • Author

    Myunghoi Kim

  • Author_Institution
    Electron. & Telecommun. Res. Inst., Daejeon, South Korea
  • Volume
    57
  • Issue
    3
  • fYear
    2015
  • fDate
    Jun-15
  • Firstpage
    595
  • Lastpage
    598
  • Abstract
    In this letter, we propose a miniaturized and wideband electromagnetic bandgap (EBG) structure with a meander-perforated plane (MPP) for power/ground noise suppression in multilayer printed circuit boards. The proposed MPP enhances the characteristic impedance of the EBG unit cell and improves the slow-wave effect, thus achieving the significant size reduction and the stopband enhancement. To explain the prominent results, a dispersion analysis for the proposed MPP-EBG structure is developed. Compared to a mushroom-type EBG structure, it is experimentally demonstrated that the MPP-EBG structure presents a 57% reduction in the start frequency of the bandgap, which leads to a 74% reduction in a unit cell size. In addition, the MPP-EBG structure considerably improves the noise suppression bandwidth (-40 dB) from 0.8 to 4.9 GHz compared to the mushroom-type EBG structure.
  • Keywords
    interference suppression; photonic band gap; printed circuits; EBG unit cell; MPP-EBG structure; characteristic impedance; compact EBG structure; dispersion analysis; frequency 0.8 GHz to 4.9 GHz; meander-perforated plane; multilayer printed circuit boards; mushroom-type EBG structure; size reduction; slow-wave effect; stopband enhancement; unit cell size reduction; wideband electromagnetic bandgap structure; wideband power-ground noise suppression; Dispersion; Metamaterials; Noise; Photonic band gap; Wideband; Electromagnetic bandgap (EBG); meander-perforated plane (MPP); power and ground noise; size reduction; stopband enhancement;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2015.2405615
  • Filename
    7053949