• DocumentCode
    856704
  • Title

    Efficient built-in redundancy analysis for embedded memories with 2-D redundancy

  • Author

    Lu, Shyue-Kung ; Tsai, Yu-Chen ; Hsu, Chih-Hsien ; Wang, Kuo-Hua ; Wu, Cheng-Wen

  • Author_Institution
    Dept. of Electron. Eng., Fu-Jen Catholic Univ., Taipei, Taiwan
  • Volume
    14
  • Issue
    1
  • fYear
    2006
  • Firstpage
    34
  • Lastpage
    42
  • Abstract
    A novel redundant mechanism is proposed for embedded memories in this paper. Redundant rows and columns are added into the memory array as in the conventional approaches. However, the redundant rows and columns are divided into row blocks and column blocks, respectively. The reconfiguration is performed at the row (column) block level instead of the conventional row (column) level. Based on the proposed redundant mechanism, we first show that the complexity of the redundancy allocation problem is NP-complete. Thereafter, an extended local repair-most (ELRM) algorithm suitable for built-in implementation is proposed. The complexity of the ELRM algorithm is O(N), where N denotes the number of memory cells. According to the simulation results, the hardware overhead for implementing this algorithm is below 0.17% for a 1024/spl times/2048-b SRAM. Due to the efficient usage of the redundant elements, the manufacturing yield, repair rate, and reliability can be improved significantly.
  • Keywords
    SRAM chips; built-in self test; computational complexity; embedded systems; redundancy; 2D redundancy; NP-complete problem; SRAM; built-in redundancy analysis; embedded memories; extended local repair-most algorithm; hardware overhead; manufacturing yield; redundancy allocation problem; redundant mechanism; repair rate; Electronics industry; Fabrication; Fault tolerance; Hardware; Logic; Random access memory; Read-write memory; Redundancy; Semiconductor device manufacture; Silicon; Embedded memory; redundancy analysis; reliability; repair rate; yield;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/TVLSI.2005.863189
  • Filename
    1603566