• DocumentCode
    860312
  • Title

    Superconducting integrated circuit fabrication with low temperature ECR-based PECVD SiO/sub 2/ dielectric films

  • Author

    Sauvageau, J.E. ; Burroughs, C.J. ; Booi, P.A.A. ; Cromar, M.W. ; Benz, R.P. ; Koch, J.A.

  • Author_Institution
    Nat. Inst. of Stand. & Technol., Boulder, CO, USA
  • Volume
    5
  • Issue
    2
  • fYear
    1995
  • fDate
    6/1/1995 12:00:00 AM
  • Firstpage
    2303
  • Lastpage
    2309
  • Abstract
    A superconducting integrated circuit fabrication process has been developed to encompass a wide range of applications such as Josephson voltage standards, VLSI scale array oscillators, SQUIDs, and kinetic-inductance-based devices. An optimal Josephson junction process requires low temperature processing for all deposition and etching steps. This low temperature process involves an electron cyclotron resonance-based plasma-enhanced chemical vapor deposition of SiO/sub 2/ films for interlayer dielectrics. Experimental design and statistical process control techniques have been used to ensure high quality oxide films. Oxide and niobium etches include endpoint detection and controlled overetch of all films. An overview of the fabrication process is presented.<>
  • Keywords
    dielectric thin films; integrated circuit technology; plasma CVD coatings; silicon compounds; sputter etching; superconducting integrated circuits; ECR PECVD SiO/sub 2/ films; Josephson junction; Josephson voltage standards; Nb; SQUIDs; SiO/sub 2/; VLSI scale array oscillators; endpoint detection; etching; experimental design; interlayer dielectrics; kinetic-inductance-based devices; low temperature processing; niobium; overetch; oxide; statistical process control; superconducting integrated circuit fabrication; Electrons; Etching; Fabrication; Josephson junctions; Plasma temperature; SQUIDs; Standards development; Superconducting integrated circuits; Very large scale integration; Voltage-controlled oscillators;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/77.403046
  • Filename
    403046