• DocumentCode
    861093
  • Title

    Oxide thickness effect on boron diffusion in thin oxide p/sup +/ Si gate technology

  • Author

    Fair, Richard B.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA
  • Volume
    17
  • Issue
    5
  • fYear
    1996
  • fDate
    5/1/1996 12:00:00 AM
  • Firstpage
    242
  • Lastpage
    243
  • Abstract
    Based on a network defect model for the diffusion of B in SiO/sub 2/ we propose that B diffuses via a peroxy linkage defect whose concentration in the oxide changes under different processing conditions. We show that as the gate oxide is scaled below 80 /spl Aring/ in thickness, additional chemical processes act to increase B diffusivity and decrease its activation energy, both as a function of the distance from the Si/SiO/sub 2/ interface. For a 15 /spl Aring/ oxide, the B diffusivity at 900/spl deg/C would increase by a factor of 24 relative to diffusion in a 100 /spl Aring/ oxide.
  • Keywords
    boron; diffusion; semiconductor doping; semiconductor process modelling; silicon compounds; 900 C; Si-SiO/sub 2/:B; Si/SiO/sub 2/ interface; activation energy; boron diffusion; chemical processes; network defect model; oxide thickness; p/sup +/ Si gate technology; peroxy linkage defect; Boron; Chemical processes; Couplings; Diffusion bonding; Diffusion processes; Intelligent networks; Oxidation; Process design;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.491842
  • Filename
    491842