DocumentCode :
861093
Title :
Oxide thickness effect on boron diffusion in thin oxide p/sup +/ Si gate technology
Author :
Fair, Richard B.
Author_Institution :
Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA
Volume :
17
Issue :
5
fYear :
1996
fDate :
5/1/1996 12:00:00 AM
Firstpage :
242
Lastpage :
243
Abstract :
Based on a network defect model for the diffusion of B in SiO/sub 2/ we propose that B diffuses via a peroxy linkage defect whose concentration in the oxide changes under different processing conditions. We show that as the gate oxide is scaled below 80 /spl Aring/ in thickness, additional chemical processes act to increase B diffusivity and decrease its activation energy, both as a function of the distance from the Si/SiO/sub 2/ interface. For a 15 /spl Aring/ oxide, the B diffusivity at 900/spl deg/C would increase by a factor of 24 relative to diffusion in a 100 /spl Aring/ oxide.
Keywords :
boron; diffusion; semiconductor doping; semiconductor process modelling; silicon compounds; 900 C; Si-SiO/sub 2/:B; Si/SiO/sub 2/ interface; activation energy; boron diffusion; chemical processes; network defect model; oxide thickness; p/sup +/ Si gate technology; peroxy linkage defect; Boron; Chemical processes; Couplings; Diffusion bonding; Diffusion processes; Intelligent networks; Oxidation; Process design;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.491842
Filename :
491842
Link To Document :
بازگشت