DocumentCode
861671
Title
Offset wide-recessed In0.49GaP/Al0.45GaAs barrier E-pHEMT with high current density
Author
Jang, K.C. ; Kim, S.W. ; Lee, J.H. ; Seo, K.S.
Author_Institution
Sch. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., South Korea
Volume
42
Issue
5
fYear
2006
fDate
3/2/2006 12:00:00 AM
Firstpage
309
Lastpage
310
Abstract
An offset wide-recessed In0.49GaP/Al0.45GaAs barrier enhancement-mode p-HEMT (E-pHEMT) with high drain current density has been developed. Achieving high gate-turn-on voltage and reducing source access resistance (RS) were the aims for the high current density E-pHEMT. The wide bandgap Al0.45GaAs barrier enabled the application of high VGS to the gate. RS was reduced by using an In0.49GaP etch stop layer with low surface defect density and reducing the source to gate spacing (LSG). An offset wide-recess to the E-pHEMT was applied to enhance breakdown voltage without increasing RS. The offset wide-recessed 0.5 μm gate E-pHEMT showed a drain current density of 440 mA/mm at VGS=1.5 V and an off-state breakdown voltage of over 21 V.
Keywords
III-V semiconductors; aluminium compounds; current density; gallium arsenide; gallium compounds; high electron mobility transistors; indium compounds; 0.5 micron; 1.5 V; 21 V; In0.49GaP-Al0.45GaAs; VGS; barrier enhancement-mode p-HEMT; drain current density; enhance breakdown voltage; gate spacing source; gate-turn-on voltage; offset wide-recessed; reducing source access resistance; surface defect density;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:20063872
Filename
1604882
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