LTS Josephson junction critical current uniformities for LSI applications

Author

Abelson, L.A. ; Daly, K. ; Martinez, N. ; Smith, A.D.

Author_Institution

Space & Technol. Group, TRW Inc., Redondo Beach, CA, USA

Volume

5

Issue

2

fYear

1995

fDate

6/1/1995 12:00:00 AM

Firstpage

2727

Lastpage

2730

Abstract

Manufacturing yields of large scale superconducting circuits depend strongly on the uniformity of junction critical currents. We report on junction manufacturing tolerances based on extensive measurements of Nb- and NbN-based junction arrays and individual junctions. Transient waveforms induced by switching of a single junction have sufficient amplitude to switch other junctions in a series array. We have measured the effect of sympathetic switching and developed damping structures to dissipate switching transients. Comparisons of critical current distributions measured on individual junctions with critical current distributions determined from series junction arrays are presented. In addition, the validity of using series arrays of large numbers of junctions to assess the critical current uniformity is discussed.<>

Keywords

Josephson effect; critical currents; integrated circuit yield; superconducting device testing; superconducting integrated circuits; superconducting switches; transient analysis; 2.5 mum; 5 mum; Josephson junction critical current uniformities; LSI applications; Nb; Nb-based junction arrays; NbN; NbN-based junction arrays; critical current distributions; damping structures; junction manufacturing tolerances; large scale superconducting circuits; manufacturing yields; series junction arrays; switching transient dissipation; sympathetic switching; transient waveforms; Critical current; Current measurement; Integrated circuit modeling; Integrated circuit technology; Josephson junctions; Large scale integration; Process control; Semiconductor device measurement; Size measurement; Testing;

fLanguage

English

Journal_Title

Applied Superconductivity, IEEE Transactions on

Publisher

ieee

ISSN

1051-8223

Type

jour

DOI

10.1109/77.403154

Filename

403154