Title :
On the profile design and optimization of epitaxial Si- and SiGe-base bipolar technology for 77 K applications. I. Transistor DC design considerations
Author :
Cressler, John D. ; Comfort, James H. ; Crabbé, Emmanuel F. ; Patton, Gary L. ; Stork, Johannes M C ; Sun, Jack Y -C ; Meyerson, Bernard S.
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fDate :
3/1/1993 12:00:00 AM
Abstract :
The DC design considerations associated with optimizing epitaxial Si- and SiGe-base bipolar transistors for the 77-K environment are examined in detail. Transistors and circuits were fabricated using four different vertical profiles, three with a graded-bandgap SiGe base, and one with a Si base for comparison. All four epitaxial-base profiles yield transistors with DC properties suitable for high-speed logic applications in the 77-K environment. The differences between the low-temperature DC characteristics of Si and SiGe transistors are highlighted both theoretically and experimentally. A performance tradeoff associated with the use of an intrinsic spacer layer to reduce parasitic leakage at low temperatures and the consequent base resistance degradation due to enhanced carrier freeze-out is identified. Evidence that a collector-base heterojunction barrier effect severely degrades the current drive and transconductance of SiGe-base transistors operating at low temperatures is provided
Keywords :
Ge-Si alloys; bipolar transistors; doping profiles; elemental semiconductors; leakage currents; semiconductor epitaxial layers; semiconductor materials; silicon; 77 K; 77-K environment; DC design considerations; LNT; Si base; Si transistors; SiGe transistors; base resistance degradation; carrier freeze-out; collector-base heterojunction barrier effect; current drive; graded-bandgap SiGe base; high-speed logic applications; intrinsic spacer layer; optimization; parasitic leakage; performance tradeoff; profile design; semiconductors; transconductance; Bipolar transistors; Circuits; Degradation; Design optimization; Germanium silicon alloys; Heterojunctions; Logic; Silicon germanium; Temperature; Transconductance;
Journal_Title :
Electron Devices, IEEE Transactions on