DocumentCode :
864457
Title :
Temperature-aware computer systems: Opportunities and challenges
Author :
Skadron, Kevin ; Stan, Mircea R. ; Huang, Wei ; Velusamy, Sivakumar ; Sankaranarayanan, Karthik ; Tarjan, David
Author_Institution :
Virginia Univ., Charlottesville, VA, USA
Volume :
23
Issue :
6
fYear :
2003
Firstpage :
52
Lastpage :
61
Abstract :
Temperature-aware design techniques have an important role to play in addition to traditional techniques like power-aware design and package- and board-level thermal engineering. The authors define the role of architecture techniques and describe hotspot, an accurate yet fast thermal model suitable for computer architecture research.
Keywords :
computer architecture; thermal management (packaging); computer architecture; temperature-aware computer systems; thermal model; Clocks; Computer architecture; Costs; Heating; Microarchitecture; Microprocessors; Packaging; Temperature; Thermal management; Thermal stresses;
fLanguage :
English
Journal_Title :
Micro, IEEE
Publisher :
ieee
ISSN :
0272-1732
Type :
jour
DOI :
10.1109/MM.2003.1261387
Filename :
1261387
Link To Document :
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