Title :
Guest editorial special issue on interface reliability
Author :
Blish, R. ; Christou, Alex ; Thomas, Robert ; Samuelson, G.
Author_Institution :
Advanced Microdevices Technology Development Group
Keywords :
Adhesives; Composite materials; Copper; Materials reliability; Materials science and technology; Mechanical factors; Metals industry; Polyimides; Semiconductor device modeling; USA Councils;
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
DOI :
10.1109/TDMR.2003.822338
