Title :
3D Integration for Introspection
Author :
Mysore, Shashidhar ; Agrawal, Banit ; Srivastava, Navin ; Lin, Sheng-Chih ; Banerjee, Kaustav ; Sherwood, Timothy
Author_Institution :
Dept. of Comput. Sci., California Univ., Santa Barbara, CA
Abstract :
In today\´s complex processors, specialized profiling and introspection hardware would be incredibly beneficial to software developers, but most proposals for its addition would increase the cost of every die manufactured. Modular, "snap-on" analysis hardware, stacked vertically with the processor die using a 3D interconnect, could be included with developer systems to assist in debugging and testing, and omitted from consumer systems to keep them economically competitive
Keywords :
integrated circuit design; integrated circuit interconnections; logic design; microprocessor chips; program debugging; program testing; system-on-chip; 3D interconnect; introspection hardware; processor die; program debugging; program testing; snap-on analysis hardware; Application software; Bonding; Costs; Hardware; Manufacturing processes; Performance analysis; Runtime; Silicon; Software testing; Stacking; 3D interconnect; 3D stacking; debugging; performance evaluation; profiling; testing;
Journal_Title :
Micro, IEEE
