DocumentCode
86599
Title
Physical Design and CAD Tools for 3-D Integrated Circuits: Challenges and Opportunities
Author
Dae Hyun Kim ; Sung Kyu Lim
Author_Institution
Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
Volume
32
Issue
4
fYear
2015
fDate
Aug. 2015
Firstpage
8
Lastpage
22
Abstract
Three-dimensional integration is a breakthrough technology that provides numerous benefits such as better performance, lower power consumption, and wide bandwidth by vertical interconnects and 3-D stacking. This paper presents an overview regarding the physical design and CAD tools suitable for 3-D integrated circuits.
Keywords
circuit CAD; three-dimensional integrated circuits; 3D integrated circuits; 3D stacking; CAD tools; bandwidth; physical design; power consumption; three-dimensional integration; vertical interconnects; CADCAM; Circuit synthesis; Integrated circuit manufacture; Optimization; Three dimensional displays; Through-silicon vias; 2.5-D integration; 3-D integration; inductive coupling; monolithic 3-D ICs; through silicon via (TSV);
fLanguage
English
Journal_Title
Design & Test, IEEE
Publisher
ieee
ISSN
2168-2356
Type
jour
DOI
10.1109/MDAT.2015.2440317
Filename
7116532
Link To Document