Title :
Physical Design and CAD Tools for 3-D Integrated Circuits: Challenges and Opportunities
Author :
Dae Hyun Kim ; Sung Kyu Lim
Author_Institution :
Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
Abstract :
Three-dimensional integration is a breakthrough technology that provides numerous benefits such as better performance, lower power consumption, and wide bandwidth by vertical interconnects and 3-D stacking. This paper presents an overview regarding the physical design and CAD tools suitable for 3-D integrated circuits.
Keywords :
circuit CAD; three-dimensional integrated circuits; 3D integrated circuits; 3D stacking; CAD tools; bandwidth; physical design; power consumption; three-dimensional integration; vertical interconnects; CADCAM; Circuit synthesis; Integrated circuit manufacture; Optimization; Three dimensional displays; Through-silicon vias; 2.5-D integration; 3-D integration; inductive coupling; monolithic 3-D ICs; through silicon via (TSV);
Journal_Title :
Design & Test, IEEE
DOI :
10.1109/MDAT.2015.2440317
