DocumentCode
867433
Title
Microstructure and mechanical properties of metal-alloy nitride (M IMII)N overcoats for rigid disks
Author
Yahisa, Y. ; Shiroishi, Y. ; Hishiyama, S. ; Ohno, T. ; Takagi, K.
Author_Institution
Hitachi Ltd., Tokyo, Japan
Volume
26
Issue
5
fYear
1990
fDate
9/1/1990 12:00:00 AM
Firstpage
2685
Lastpage
2687
Abstract
Mechanical durability and microstructures are investigated for metal alloy nitride overcoats consisting of (M IM II)N, where M I=Ti or Zr and M I=V, Nb, or Ta. The overcoats are prepared by conventional reactive RF sputtering. It is demonstrated that stoichiometric nitrides are formed for a nitrogen content at or higher than 50 vol.% in a nitrogen-argon gas mixture during deposition. The average grain sizes of Zr-based alloy nitrides are 4 to 5 nm, while those of Ti-based alloy nitrides are 10 to 13 nm. The mechanical durability of the Zr-based alloy nitrides is much higher than that of the Ti-based ones. Overcoats of (Zr1-xNbx)N show the highest durability; this occurs at a Nb content, x , of 0.4 to 0.6. Zirconium-niobium nitrides exhibit a durability higher than that of conventional carbon overcoats in both pin-on-disk and continuous slow-grinding tests. This is due to the smaller grain size and more durable oxidized surface layer in the zirconium-niobium nitride films. The zirconium-alloy nitride overcoats thus exhibit the most promising mechanical properties for rigid-disk application
Keywords
hard discs; metallic thin films; niobium alloys; protective coatings; sputtered coatings; tantalum alloys; titanium alloys; vanadium alloys; zirconium alloys; 10 to 13 nm; 4 to 5 nm; TiNbN; TiTaN; TiVN; ZrNbN; ZrTaN; ZrVN; continuous slow-grinding tests; grain sizes; mechanical durability; metal alloy nitride overcoats; pin-on-disk; reactive RF sputtering; rigid disks; stoichiometric nitrides; Grain size; Mechanical factors; Microstructure; Niobium alloys; Nitrogen; Solids; Substrates; Testing; Titanium alloys; Zirconium;
fLanguage
English
Journal_Title
Magnetics, IEEE Transactions on
Publisher
ieee
ISSN
0018-9464
Type
jour
DOI
10.1109/20.104838
Filename
104838
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