DocumentCode :
867755
Title :
Foreword Wafer-Level Packaging: Interconnects for Enhanced Reliability
Author :
Nguyen, L. T.
Volume :
32
Issue :
2
fYear :
2009
fDate :
5/1/2009 12:00:00 AM
Firstpage :
360
Lastpage :
361
Abstract :
The four articles in this special section focus on wafer-level packaging and interconnects for enhanced reliability.
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2009.2022602
Filename :
4926129
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=867755
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