DocumentCode :
868187
Title :
Reliability and product integrity
Author :
Gollomp, Bernie
Volume :
5
Issue :
4
fYear :
2002
Firstpage :
61
Lastpage :
62
Keywords :
Assembly; Defense industry; Integrated circuit interconnections; Joining processes; Maintenance; Manufacturing industries; Material properties; Reliability engineering; Testing; Wire;
fLanguage :
English
Journal_Title :
Instrumentation & Measurement Magazine, IEEE
Publisher :
ieee
ISSN :
1094-6969
Type :
jour
DOI :
10.1109/MIM.2002.1048984
Filename :
1048984
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=868187
