DocumentCode :
870596
Title :
Electrical test strategies for a wafer-level packaging technology [Abstracts of Forthcoming Manuscripts]
Author :
Keezer, David C. ; Patel, Chirag S. ; Bakir, Muhannad S. ; Zhou, Qing ; Meindl, James D.
Author_Institution :
Georgia Institute of Technology
Volume :
26
Issue :
4
fYear :
2003
Firstpage :
264
Lastpage :
264
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/TEPM.2003.823162
Filename :
1262393
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=870596
