DocumentCode
870596
Title
Electrical test strategies for a wafer-level packaging technology [Abstracts of Forthcoming Manuscripts]
Author
Keezer, David C. ; Patel, Chirag S. ; Bakir, Muhannad S. ; Zhou, Qing ; Meindl, James D.
Author_Institution
Georgia Institute of Technology
Volume
26
Issue
4
fYear
2003
Firstpage
264
Lastpage
264
fLanguage
English
Journal_Title
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
1521-334X
Type
jour
DOI
10.1109/TEPM.2003.823162
Filename
1262393
Link To Document