• DocumentCode
    872500
  • Title

    X-band IMPATT microstrip power sources

  • Author

    Wagner, Richard J. ; Gray, William W. ; Cooper, Paul V.

  • Volume
    3
  • Issue
    3
  • fYear
    1968
  • Firstpage
    221
  • Lastpage
    225
  • Abstract
    Silicon avalanche transit-time diodes have been integrated with microstrip oscillator circuits to produce miniaturized X-band power sources. The oscillator circuits are fabricated using thin-film gold or copper on 1 inch by 1 inch, 25-mil thick alumina substrates. Circuits using both capacitive and inductive output coupling have been used with success. CW X-band powers greater than 500 mW at approximately 3 percent efficiency are obtained with these circuits. A method of heat sinking the diodes, which allows input powers up to 25 watts in a 6-mil junction diameter, is discussed. Some of the features of the power sources considered for applications were measured at various power levels and are presented. These include FM and AM noise, injection- locking characteristics, and power accumulation from more than a single diode.
  • Keywords
    Hybrid integrated circuits; hybrid integrated circuits; Copper; Coupling circuits; Diodes; Gold; Heat sinks; Microstrip; Oscillators; Silicon; Substrates; Thin film circuits;
  • fLanguage
    English
  • Journal_Title
    Solid-State Circuits, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    0018-9200
  • Type

    jour

  • DOI
    10.1109/JSSC.1968.1049887
  • Filename
    1049887