DocumentCode
872500
Title
X-band IMPATT microstrip power sources
Author
Wagner, Richard J. ; Gray, William W. ; Cooper, Paul V.
Volume
3
Issue
3
fYear
1968
Firstpage
221
Lastpage
225
Abstract
Silicon avalanche transit-time diodes have been integrated with microstrip oscillator circuits to produce miniaturized X-band power sources. The oscillator circuits are fabricated using thin-film gold or copper on 1 inch by 1 inch, 25-mil thick alumina substrates. Circuits using both capacitive and inductive output coupling have been used with success. CW X-band powers greater than 500 mW at approximately 3 percent efficiency are obtained with these circuits. A method of heat sinking the diodes, which allows input powers up to 25 watts in a 6-mil junction diameter, is discussed. Some of the features of the power sources considered for applications were measured at various power levels and are presented. These include FM and AM noise, injection- locking characteristics, and power accumulation from more than a single diode.
Keywords
Hybrid integrated circuits; hybrid integrated circuits; Copper; Coupling circuits; Diodes; Gold; Heat sinks; Microstrip; Oscillators; Silicon; Substrates; Thin film circuits;
fLanguage
English
Journal_Title
Solid-State Circuits, IEEE Journal of
Publisher
ieee
ISSN
0018-9200
Type
jour
DOI
10.1109/JSSC.1968.1049887
Filename
1049887
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