DocumentCode :
873507
Title :
Comparisons of conventional, 3-D, optical, and RF interconnects for on-chip clock distribution
Author :
Chen, Kuan-Neng ; Kobrinsky, Mauro J. ; Barnett, Brandon C. ; Reif, Rafael
Author_Institution :
Microsystems Technol. Labs., Massachusetts Inst. of Technol., Cambridge, MA, USA
Volume :
51
Issue :
2
fYear :
2004
Firstpage :
233
Lastpage :
239
Abstract :
This paper analyzes the performance of different interconnect technologies for on-chip clock distribution, including conventional, three-dimensional, optical, and radio frequency interconnects. Skew, power, and area usage were estimated for each of these technologies based on the 2001 International Technology Roadmap for Semiconductors. Our results indicate that most of the skew and power are associated with local clock distribution. Consequently, since the alternative clock distribution approaches that have been proposed focus on global clock distribution, we have not found significant advantages over conventional clock distribution in terms of skew and power. Furthermore, it was found that low skews could be attained with conventional clock distribution schemes if the clock signals are not scaled down.
Keywords :
clocks; integrated circuit interconnections; integrated circuit modelling; optical interconnections; system-on-chip; timing circuits; 2001 International Technology Roadmap for Semiconductors; 3D interconnects; RF interconnects; area usage; conventional interconnects; global clock distribution; interconnect technologies; local clock distribution; on-chip clock distribution; optical interconnects; power usage; radio frequency interconnects; skew; Clocks; Crosstalk; Jitter; Optical buffering; Optical interconnections; Optical network units; Paper technology; Performance analysis; RF signals; Radio frequency;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2003.821567
Filename :
1262652
Link To Document :
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