• DocumentCode
    873787
  • Title

    Effect of Gate Leakage in the Subthreshold Characteristics of AlGaN/GaN HEMTs

  • Author

    Chung, Jinwook W. ; Roberts, John C. ; Piner, Edwin L. ; Palacios, Tomás

  • Author_Institution
    Microsyst. Technol. Labratories, Massachusetts Inst. of Technol., Cambridge, MA
  • Volume
    29
  • Issue
    11
  • fYear
    2008
  • Firstpage
    1196
  • Lastpage
    1198
  • Abstract
    This letter studies the effect of gate leakage on the subthreshold slope and ON/OFF current ratio of AlGaN/GaN high-electron mobility transistors (HEMTs). We found a strong correlation between the gate leakage current and the transistor subthreshold characteristics: the lower the gate leakage, the higher the ON/OFF ratio and the steeper the subthreshold slope. To improve the subthreshold characteristics in GaN HEMTs, the gate leakage current was reduced with an O2 plasma treatment prior to the gate metallization. The O2 plasma treatment effectively reduces the gate leakage current by more than four orders of magnitude, it increases the ON/OFF ratio to more than seven orders of magnitude and the improved AlGaN/GaN HEMT shows a nearly ideal subthreshold slope of 64 mV/dec.
  • Keywords
    III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; leakage currents; metallisation; wide band gap semiconductors; AlGaN-GaN; AlGaN/GaN HEMT; O2 plasma treatment; gate leakage current; gate metallization; high-electron mobility transistors; on/off current ratio; subthreshold slope; GaN; gate leakage; high-electron mobility transistor (HEMT); plasma treatment; subthreshold slope;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2008.2005257
  • Filename
    4633673