DocumentCode
873787
Title
Effect of Gate Leakage in the Subthreshold Characteristics of AlGaN/GaN HEMTs
Author
Chung, Jinwook W. ; Roberts, John C. ; Piner, Edwin L. ; Palacios, Tomás
Author_Institution
Microsyst. Technol. Labratories, Massachusetts Inst. of Technol., Cambridge, MA
Volume
29
Issue
11
fYear
2008
Firstpage
1196
Lastpage
1198
Abstract
This letter studies the effect of gate leakage on the subthreshold slope and ON/OFF current ratio of AlGaN/GaN high-electron mobility transistors (HEMTs). We found a strong correlation between the gate leakage current and the transistor subthreshold characteristics: the lower the gate leakage, the higher the ON/OFF ratio and the steeper the subthreshold slope. To improve the subthreshold characteristics in GaN HEMTs, the gate leakage current was reduced with an O2 plasma treatment prior to the gate metallization. The O2 plasma treatment effectively reduces the gate leakage current by more than four orders of magnitude, it increases the ON/OFF ratio to more than seven orders of magnitude and the improved AlGaN/GaN HEMT shows a nearly ideal subthreshold slope of 64 mV/dec.
Keywords
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; leakage currents; metallisation; wide band gap semiconductors; AlGaN-GaN; AlGaN/GaN HEMT; O2 plasma treatment; gate leakage current; gate metallization; high-electron mobility transistors; on/off current ratio; subthreshold slope; GaN; gate leakage; high-electron mobility transistor (HEMT); plasma treatment; subthreshold slope;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2008.2005257
Filename
4633673
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