Title :
Experimental Studies of Contact Detachment Delay in Microrelays for Logic Applications
Author :
Yenhao Chen ; I-Ru Chen ; Chuang Qian ; Peschot, Alexis ; Liu, Tsu-Jae King
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Univ. of California at Berkeley, Berkeley, CA, USA
Abstract :
The abrupt switching behavior of mechanical switches makes it imperative to ensure that they turn OFF more rapidly than they turn ON. In a complementary logic circuit, slower turn-OFF than turn-ON could lead to the formation of a direct current path between the power supply and the ground, which would result in undesirable dynamic power dissipation during signal transitions. In this brief, the contact detachment delay (τCD) of microrelays is systematically characterized and investigated. τCD is shown to be correlated with contact adhesive force and the mechanical properties of the contact materials; τCD can also be reduced by ultrathin-oxide coating and contact area scaling.
Keywords :
logic circuits; microrelays; contact adhesive force; contact area scaling; contact detachment delay; contact materials; logic circuit; mechanical properties; mechanical switches; microrelays; power dissipation; power supply; signal transitions; ultrathin-oxide coating; Adhesives; Delays; Electrodes; Force; Metals; Microrelays; Contact detachment delay; crowbar current; microrelay; pull-in delay; reliability; reliability.;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2015.2446960