• DocumentCode
    873919
  • Title

    A 3-D study of eddy current field and temperature rises in a compact bus duct system

  • Author

    Ho, S.L. ; Li, Y. ; Lin, X. ; Wong, H.C. ; Cheng, K.W.E.

  • Author_Institution
    Dept. of Electr. Eng., Hong Kong Polytech., Kowloon
  • Volume
    42
  • Issue
    4
  • fYear
    2006
  • fDate
    4/1/2006 12:00:00 AM
  • Firstpage
    987
  • Lastpage
    990
  • Abstract
    In this paper, a three-dimensional eddy-current field model for calculating the eddy-current losses in a compact bus duct system is proposed. The temperature rises in the compact bus duct system, including both the long linear section and connecting unit, are evaluated using finite-element method when solving the governing thermal equations. The contact resistance between copper conductors and the corresponding temperature rises are measured in the test also. The computations are validated by test results and the results confirm the proposed algorithm is accurate and practical
  • Keywords
    conductors (electric); contact resistance; eddy current losses; electric conduits; finite element analysis; 3D eddy-current field model; compact bus duct system; contact resistance; copper conductors; eddy-current losses; finite-element method; thermal equations; Conductors; Contact resistance; Copper; Ducts; Eddy currents; Equations; Finite element methods; Joining processes; Temperature measurement; Testing; Bus duct system; eddy-current loss; temperature rise;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/TMAG.2006.871632
  • Filename
    1608374