DocumentCode :
873952
Title :
Low-power bipolar transistor memory cells
Author :
Hodges, David A. ; Lepselter, Martin P. ; Lynes, D.J. ; MacDonald, Robert W. ; Macrae, Alfred U. ; Waggener, Herbert A.
Volume :
4
Issue :
5
fYear :
1969
fDate :
10/1/1969 12:00:00 AM
Firstpage :
280
Lastpage :
284
Abstract :
Low- and high-barrier Schottky diodes have been combined with bipolar transistors to produce planar integrated-circuit low-area memory cells that hold at 75 μW. Low-barrier diodes formed on p-type ion-implanted silicon (10/SUP 17/ cm/SUP -3/) are used as high-resistance collector loads. High-barrier diodes formed on n-type epitaxial silicon (10/SUP 16/ cm/SUP -3/) provide low-capacitance low-leakage coupling to digit lines in a memory array. The highly reproducible rhodium silicide on silicon Schottky diodes, as well as high-quality ohmic contacts, are formed in one sequence of sputtering and high-temperature operations. The process is fully compatible with beam-lead technology. It is estimated that a 512-word memory module using these cells would operate at a 60-ns READ or WRITE cycle time.
Keywords :
Digital storage; Integrated circuits; Semiconductor diodes; Semiconductor storage devices; digital storage; integrated circuits; semiconductor diodes; semiconductor storage devices; Bipolar transistors; Costs; Energy consumption; Flip-flops; Integrated circuit technology; Resistors; Schottky diodes; Semiconductor diodes; Semiconductor memory; Silicon;
fLanguage :
English
Journal_Title :
Solid-State Circuits, IEEE Journal of
Publisher :
ieee
ISSN :
0018-9200
Type :
jour
DOI :
10.1109/JSSC.1969.1050016
Filename :
1050016
Link To Document :
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