Microminiature solid-state imaging system utilizing hybrid LSI techniques

The authors describe the design, construction, and performance characteristics of a low-resolution 50×80 element solid-state imaging system that has been fabricated using multichip large-scale integration. Techniques used to fabricate the substrate that contains 117 MOS and low-power bipolar integrated circuits plus the 4000-element phototransistor mosaic sensor array are discussed. Also, the methods used to mount and provide interdevice signal paths, including the use of advanced multilayer flexible interconnection techniques are shown.