DocumentCode
876685
Title
Development of a multichip module DSP
Author
Scannell, Robert K. ; Hagge, John K.
Author_Institution
Rockwell Int., Anaheim, CA, USA
Volume
26
Issue
4
fYear
1993
fDate
4/1/1993 12:00:00 AM
Firstpage
13
Lastpage
21
Abstract
The signal processor packaging design (SPPD) general-purpose digital signal processor (DSP) architecture is discussed. SPPD is a highly modular processor architecture that is based on off-the-shelf components and that supports a multichip module (MCM) design implementation that delivers 400 million floating-point operations per second in a 75-g package. The interconnect-substrate design, MCM package assembly, MCM testing, and tradeoffs in size, weight, and cost of the SPPD packaging are described.<>
Keywords
digital signal processing chips; multichip modules; MCM package assembly; cost; highly modular processor architecture; interconnect-substrate design; multichip module DSP; signal processor packaging design; size; weight; Assembly; Costs; Digital signal processing; Digital signal processors; Multichip modules; Packaging; Process design; Signal design; Signal processing; Testing;
fLanguage
English
Journal_Title
Computer
Publisher
ieee
ISSN
0018-9162
Type
jour
DOI
10.1109/2.206508
Filename
206508
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