• DocumentCode
    877281
  • Title

    Conceptual Topology for the Integration of Planar and Quasi 3D Antennas in Chip Packages

  • Author

    Vandenbosch, Guy A E ; Mestdagh, Steven

  • Author_Institution
    Dept. of Electr. Eng., Katholieke Univ. Leuven, Leuven
  • Volume
    56
  • Issue
    10
  • fYear
    2008
  • Firstpage
    3090
  • Lastpage
    3096
  • Abstract
    A conceptual topology for the integration of antennas in chip packages is proposed. First, the complete topology is presented and discussed. Then, a full antenna design is described, including fabrication and measurement of a scale model of the basic radiating structure. Finally, a numerical study of the shielding capabilities of the conceptual structure is given.
  • Keywords
    antenna radiation patterns; chip scale packaging; electromagnetic shielding; planar antennas; antenna design; chip packages; conceptual topology; planar antennas; quasi 3D antennas; radiating structure; scale model fabrication; Antenna accessories; Bandwidth; Costs; Integrated circuit interconnections; Integrated circuit packaging; Microstrip antennas; Millimeter wave integrated circuits; Millimeter wave technology; Resonant frequency; Topology; Chip packaging; integrated antennas; shielding; small antennas;
  • fLanguage
    English
  • Journal_Title
    Antennas and Propagation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-926X
  • Type

    jour

  • DOI
    10.1109/TAP.2008.929456
  • Filename
    4636855