Gold-to-aluminum bonding for TAB applications

Author

Kang, Sung K.

Author_Institution

IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA

Volume

15

Issue

6

fYear

1992

fDate

12/1/1992 12:00:00 AM

Firstpage

998

Lastpage

1004

Abstract

In thermocompression bonding used in tape automated bonding (TAB) technology, the gold-to-aluminum interface is one of the most difficult bonds that can be formed, because a thin aluminum oxide layer inhibits bonding at low temperatures. The usual bonding temperature is, therefore, expected to be higher than 500°C. This results in extensive growth of intermetallics. In an effort to reduce the bonding temperature of a TAB application, a laser-processed gold-plated balltape was used for thermocompression bonding to aluminum. The effects of hardness, thickness, and morphology of the gold layer on thermocompression bonding have been investigated. As a result, an improved gold layer surface morphology has been developed by controlling the plating rate. The new bumped tape structure was bonded at temperatures from 500°C down to as low as 350°C

Keywords

aluminium; gold; laser beam applications; tape automated bonding; 500 to 350 C; Au-Al bonding; TAB applications; balltape; bonding temperature; bumped tape structure; difficult bonds; growth of intermetallics; laser-processed; plating rate; surface morphology; tape automated bonding; thermocompression bonding; Aluminum; Bonding; Copper; Gold; Intermetallic; Laser beams; Packaging; Temperature; Very large scale integration; Wire;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.206923

Filename

206923