Reliability assessment of high lead count TAB package

Author

Ling, Jamin ; Teoh, Hongbee ; Sorrells, David ; Jones, Jack

Author_Institution

Digital Equipment Corp., Hudson, MA, USA

Volume

15

Issue

6

fYear

1992

fDate

12/1/1992 12:00:00 AM

Firstpage

1105

Lastpage

1116

Abstract

The reliability assessment of a high-lead-count tape automated bonding (TAB) package using advanced packaging technology is described. The package was developed to replace existing leaded chip carriers for high I/O and high-performance applications. The package technology uses Au bumps and Au-plated, single-metal two-layer 70-mm Cu tape with a polyimide support ring. After inner lead bonding and chip encapsulation, the chip-on-tape was epoxy attached to a ceramic base and lid. This clamshell design provided both mechanical and environmental protection to the integrated circuit device

Keywords

environmental testing; packaging; polymer films; reliability; tape automated bonding; 70 mm; Au bumps; Au-Cu tape; advanced packaging technology; ceramic base; ceramic lid; chip encapsulation; chip-on-tape; clamshell design; environmental protection; high I/O; high lead count TAB package; high-performance applications; inner lead bonding; integrated circuit device; package technology; polyimide support ring; reliability assessment; replace existing leaded chip carriers; Assembly; Bonding; Ceramics; Encapsulation; Gold; Integrated circuit packaging; Integrated circuit technology; Polyimides; Protection; Testing;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.206937

Filename

206937