Are components still the major problem: a review of electronic system and device field failure returns

Author

Pecht, Michael ; Ramappan, Vijay

Author_Institution

CALCE Electron. Packaging Res. Center, Maryland Univ., College Park, MD, USA

Volume

15

Issue

6

fYear

1992

fDate

12/1/1992 12:00:00 AM

Firstpage

1160

Lastpage

1164

Abstract

A collection of electronic system and device (component) failure data from various sources over the last 20 years (1972-1992) is presented. Categories of failures are illustrated by means of pie charts. Issues of data collection and confusions in the definitions of failure mechanisms, failure sites, and stages of failure occurrence (design, manufacturing, testing) are discussed. The most recent data are then evaluated, the contribution of the inherent component failures to the system failures is analyzed, and conclusions of significance to the industry are discussed

Keywords

failure analysis; data collection issues; definitions confusions; definitions of failure mechanisms; device field failure returns; electronic system field failure returns; failure data; failure sites; inherent component failures; pie charts; review; stages of failure occurrence; system failures; Bonding; Connectors; Corrosion; Failure analysis; Fatigue; Helium; Lead; Manufacturing industries; Testing; Wire;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.206943

Filename

206943