Title :
Therhionic Integrated Circuits: Electronics for Hostile Environments
Author :
Lynn, D.K. ; McCormick, J.B. ; MacRoberts, M.D.J. ; Wilde, D.K. ; Dooley, G.R. ; Brown, D.R.
Author_Institution :
Electronics Division Los Alamos National Laboratory Los Alamos, NM 87545
Abstract :
Thermionic integrated circuits (TICs) combine thermionic emission of vacuum tube technology with the thin-film deposition and photolithographic delineation techniques of conventional silicon integrated circuits to form microminiature-integrated vacuum triode circuits. The resulting integrated circuits are extremely tolerant to both high-radiation and high-temperature environments.
Keywords :
Anodes; Bonding; Cathodes; Circuit testing; Electrodes; Electron emission; Substrates; Thermionic emission; Titanium; Voltage;
Journal_Title :
Nuclear Science, IEEE Transactions on
DOI :
10.1109/TNS.1985.4334057
